Tokyo Electron Limited (OTCMKTS:TOELY) Sees Significant Drop in Short Interest

Tokyo Electron Limited (OTCMKTS:TOELYGet Free Report) saw a significant decrease in short interest during the month of October. As of October 15th, there was short interest totalling 49,100 shares, a decrease of 82.9% from the September 30th total of 286,500 shares. Based on an average daily volume of 250,700 shares, the short-interest ratio is currently 0.2 days.

Tokyo Electron Stock Performance

TOELY traded up $0.54 during mid-day trading on Friday, reaching $77.25. The stock had a trading volume of 141,036 shares, compared to its average volume of 175,051. The stock has a market capitalization of $143.07 billion, a P/E ratio of 28.82 and a beta of 1.50. Tokyo Electron has a 52 week low of $64.30 and a 52 week high of $134.91. The firm’s fifty day simple moving average is $85.02 and its two-hundred day simple moving average is $100.52.

Tokyo Electron (OTCMKTS:TOELYGet Free Report) last posted its quarterly earnings results on Thursday, August 8th. The company reported $0.87 earnings per share (EPS) for the quarter. The business had revenue of $3.56 billion for the quarter, compared to analysts’ expectations of $3.12 billion. Tokyo Electron had a return on equity of 24.79% and a net margin of 21.32%. As a group, analysts expect that Tokyo Electron will post 3.23 EPS for the current fiscal year.

Analysts Set New Price Targets

Separately, Sanford C. Bernstein upgraded shares of Tokyo Electron to a “strong-buy” rating in a research report on Monday, October 7th.

Get Our Latest Stock Analysis on Tokyo Electron

Tokyo Electron Company Profile

(Get Free Report)

Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, wafer edge trimming, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems.

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